ALPHA® OM-5300

锡膏

ALPHA®OM-5300 免清洗锡膏可在电路组装中有无铅组件时满足锡铅焊接的需求。OM-5300 与所有 Alpha 锡膏一样,具有出色的印刷量重复性,可最大程度减少印刷工艺中的变化。OM-5300 通过较高的印刷速度以及模板未清洗干净之间更多的印刷次数,最大程度减少了印刷周期时间。

OM-5300 因其承受长时间热保温回流曲线的能力而与众不同,可以更好地润湿无铅表面与锡铅锡膏合金。非常低的 BGA 空洞,加上非常高的回流后 SIR 读数让 OM-5300 十分适合在使用无铅组件的情况下进行锡铅焊接。

OM-5300 也是一款零卤素产品,配方中没有故意加入卤素。

特点和优势

  • Print Consistency: Lower “deposit to deposit” variation drives maximization of first pass print and reflow yield
  • Fine Feature Capability: High print deposit volumes and low volume variability down to 12 mil (0.30mm) circle feature sizes.
  • Low BGA Voiding: Class III voiding resistance even when SAC 305 BGA speres are used.
  • Electrical Reliability: Exceeds the requirements of the IPC and Bellcore SIR electrical reliability tests.
  • Suitable for fine pitch applications such as 0.5 mm (20mil) pitch Flip-Chip and 0201 assembly.
  • Excellent response to pause performance, generating fewer defects due to start up.
  • High print speed, up to 150 mm/sec (6 inch/sec)
  • Efficient activation system providing defect free soldering with a wide range of oven profiles
  • High yield for in circuit testing (low level of false negatives)

请注意,英文版提供了最完整和最新的信息。更新本地语言信息时会有延迟。

 
  
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