ALPHA® OM-363 是一种无铅、无卤素的免清洗锡膏,设计用于最大程度减少 BGA 无润湿空焊和球窝缺陷。这种锡膏的化学特性延续了Alpha作为业界领导者的传统,提供出色的引脚测试属性,实现较高的首次通过电路内测试良率。

ALPHA® OM-363 锡膏也被设计支持一致的间距印刷能力,最小为使用 180mm厚的模板印刷的 100mm圆。其出色的印刷量沉积重复性还可以通过减少与印刷工艺可变性相关的缺陷提供价值。此外,ALPHA® OM-363 锡膏还具有 IPC7095 III 类空洞性能。


  • Long Stencil Life: consistent performance for at least 8 hours of continuous printing without addition of new paste
  • Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment
  • Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C
  • Reduced Random Solder Ball Levels: minimizes rework and increases first time yield
  • Excellent Coalescence and Wetting Performance: coalesced 180µm circle deposit, even at high soak profile environment
  • Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high thermal soaking, without charring or burning
  • Excellent Voiding Performance: Meets IPC7095 Class III Requirement
  • Halogen Content: Halogen-free
  • Residue: Excellent Pin Testing property
  • Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements (see table below), as well as TOSCA & EINECS


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