ALPHA® OM-351是一种无铅、零卤素的免清洗锡膏,设计用于需要超低空洞性能、出色的电路内测试引脚测试首次通过良率,以及通过 JIS 铜腐蚀测试能力的应用。

ALPHA® OM-351被设计用于支持一致的微间距印刷能力,使用 100μm 厚的模板可低至 220μm2,并且可用于 01005 芯片组件应用。被设计用于支持一致的微间距印刷能力,使用 100μm 厚的模板可低至 220μm2,并且可用于 01005 芯片组件应用。

ALPHA® OM-351对 170μm 圆形沉积展现出了良好的熔融愈合能力,以及出色的 IPC III 类超低空洞性能。该产品被设计为在 N2 环境的保温回流曲线下具有最佳性能。


  • Long Stencil Life: engineered for consistent performance in warm/humid production climates, reducing variations in print performance and paste dry-out
  • High Tack Force Life: ensures high pick-and-place yields, good self-alignment
  • Wide Reflow Profile Window: enables quality soldering of complex, high density PWB assemblies in an N2 environment, using high ramp rates and soak profiles as high as 175°C to 185°C
  • Reduced Mid Chip Solder Balling and Head-in-Pillow Defects: minimizes rework and increases first time yield
  • Excellent Coalescence and Wetting Performance: coalesces well for 170µm small circle deposit at high soak profile nitrogen environment
  • Excellent Solder Joint and Flux Residue Cosmetics: residue does not char or burn after reflow soldering, even when using long/high thermal soaking
  • Excellent Voiding Performance: Exceeds IPC7095 Class III requirement for BGA and best in class for LGA
  • Halogen Content: Zero Halogen, no halogen intentionally added
  • Residue: Excellent ICT Pin Testing property and Pass JIS Copper Corrosion Test
  • Safe and Environmentally Friendly: Materials comply with ROHS, TOSCA, EINECS and Halogen-free requirements (Zero Halogen, see table below)


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