ALPHA® JP-500 是一款无铅免清洗锡膏,设计用于在喷墨印刷机中使用。ALPHA JP-500 具有能够进行标准点胶或喷射的流变学。ALPHA JP-500 采用了零卤素助焊剂配方,可提供同类产品中最高的电路内引脚测试良率、高电气可靠性。出色的回流工艺窗口在 CuOSP、无铅 HSAL、浸银、浸锡和 ENIG 饰面上提供出色的焊接效果。

ALPHA JP-500采用的配方可产生出色的焊点外观。此外,根据 IPC J-STD-004,ALPHA JP-500 被评为 ROL0 级别。


  • Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”)
  • Excellent deposit consistency with high process capability index across all board designs
  • Designed for use with the Mycronic Jet Printers
  • Zero Halogen (no halogen intentionally added to the formulation)
  • Wide reflow profile window with good solderability on various board / component finishes
  • Excellent solder and flux cosmetics after reflow soldering
  • Reduction in random solderballing levels, minimizing rework and increasing first time yield
  • Excellent pin-test yield for single and double reflow
  • Meets highest IPC 7095 voiding performance classification of Class III
  • Excellent reliability properties, zero halide material
  • Capable of high reflow yield without the use of nitrogen


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