Alpha LED 芯片粘接

Alpha 特殊的材料技术基于对 LED 领域和研发的投入,我们清楚地认识到应在 LED 装配过程的每个关机步骤为客户提供价值。芯片粘接 Alpha 专门研制的 LED 粘接材料包括 倒装芯片、横向、纵向,主板的芯片粘接。Alpha 具有全面的产品能解决固态照明市场的关键问题,如热管理、效率和亮度、可靠性和寿命。

Alpha LED Application Chip Table

 
   Conductive Adhesive
Solder Paste
Pressure Sintering
Product Name
 Atrox™ Lumet™
Argomax®

Thermal Conductivity (W/mK)

7-90
 50-60  200+
 Application Method

Pin Transfer
Printing

Dispense
Pin-Transfer

Film
Secondary Reflow Profile
Yes
No Yes
Surface Finish Compatibility
     
 Chip Structure Recommendation
  • Lateral
  • Vertical
  • Flip Chip on Board (FCoB)
  • Chip on Board (CoB)
  • Vertical in Package

 

 
  
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