ALPHA® PoP 707

锡膏

这种免清洗助焊剂经过设计可作为 BGA 封装的浸助焊剂。它可在已经浸入助焊剂的球面上提供均匀可重复的助焊剂量。助焊剂的流变学可以让其在子组件的助焊剂放置完成后保持在浸没的球面上,同时轻松让助焊剂镀液保持水品。这种助焊剂被设计为支持在回流前预组装堆叠 BGA 封装。

助焊剂属性

  • Appearance Smooth, white to off-white paste
  • Viscosity (Spiral/Malcom) Typically 430 Poise @10 rpm @ 25°C
  • Tack strength (per IPC J-STD-004)
  • Initial 10.6 grams / sq mm, typical
  • 6 hr @ 50% RH 8.3 grams / sq mm, typical
  • 24 hr @ 50% RH 8.8 grams / sq mm, typical
  • Fineness of Grind <10 m
  • Acid Number (mg KOH/g) 140 – 170 (1st batch = 166.9)
  • Corrosivity Passes IPC Cu mirror, Cu corrosion
  • Halide Content Halide free (ROL0 per IPC J-STD-004)
  • Moisture Content < 1.0 % (w/w)
  • Specific Gravity 1.02 grams / cc
  • J-STD-004 SIR (pass > 108) 4.2 x 109 Ohms, 1 Day, un-cleaned
  • J-STD-004 SIR (pass > 108) 6.8 x 109 Ohms, 4 Days, un-cleaned
  • J-STD-004 SIR (pass > 108) 8.9 x 109 Ohms, 7 Days, un-cleaned
  • BELLCORE SIR (pass > 1011) 7.3 x 1011 Ohms, 1 Day, un-cleaned
  • BELLCORE SIR (pass > 1011) 3.5 x 1011 Ohms, 4 days, un-cleaned
  • Electromigration (500 hours) 1.6 x 1011 Ohms, 96 hours
  • (BELLCORE) 4.0 x 1011 Ohms, 500 hours (pass: final > init /10)

请注意,英文版提供了最完整和最新的信息。更新本地语言信息时会有延迟。 

 
  
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