ALPHA® OM-338 CSP

锡膏

ALPHA®OM-338-CSP 是一款无铅免清洗锡膏,设计用于多种应用。ALPHA OM-338-CSP 较宽的加工窗口设计用于最大程度减少从锡/铅到无铅锡膏的过渡问题。这种材料被设计为具有与锡铅工艺相媲美的性能。* ALPHA OM-338-CSP 在多种电路板设计上都能产生出色的印刷能力性能,尤其是在具有超精细特征重复性和高“吞吐量”的应用中。出色的回流工艺窗口提供了良好的 CuOSP 焊接性,能够出色地熔融愈合多种沉积尺寸,具有出色的抗随机锡珠形成性以及片式元件间锡珠性能。ALPHA OM-338-CSP 采用的配方可产生出色的焊点外观。此外,ALPHA OM-338-CSP 的 IPC III 类空洞和 ROL0 IPC 分类能力确保了最大程度提高长期产品可靠性。

*尽管这些无铅合金的外观与锡铅合金的不同,但机械可靠性却与锡铅或锡铅银合金相同或更胜一筹。

特点和优势

  • Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.24mm (0.096”) with 0.100mm (4mil) stencil thickness.
  • Excellent print consistency with high process capability index across all board designs.
  • Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput
  • Wide reflow profile window with good solderability on various board / component finishes.
  • Excellent solder and flux cosmetics after reflow soldering.
  • Reduction in random solderballing levels, minimizing rework and increasing first time yield.
  • Meets highest IPC 7095 voiding performance classification of Class III.
  • Excellent reliability properties, halide-free material.
  • Compatible with either nitrogen or air reflow

请注意,英文版提供了最完整和最新的信息。更新本地语言信息时会有延迟。


 
  
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