ALPHA® CVP-520

锡膏

ALPHA®CVP-520 设计用于实现低温表面贴装组装技术。ALPHA CVP-520 中的无铅合金熔点低于 140°C,并且已成功在 155°C 到 190°C 之间用于峰值回流曲线。ALPHA CVP-520 的助焊剂残留物透明、无色,具有很高的电阻率,超出行业标准。装配中使用温敏通孔元件时,此产品可以免除额外的波峰焊或选择性波峰焊工艺。免除波峰焊或选择性焊接步骤可以大大降低生产电子装配的成本,增加日吞吐量,并且无需管理焊条和波峰焊助焊剂供应,也无需使用托盘。

ALPHA CVP-520 中精心选择的锡/铋/银合金可用于在熔化和再凝固期间提供最低的熔点、最低的糊状范围,以及非常精细的颗粒结构,可最大程度抵抗热循环疲劳。合金还可产生空洞很少的 BGA 焊点,即使在使用传统 SAC 合金球的情况下也是如此。ALPHA Exactalloy™ 预成型系列预成型坯件可在必要时提供额外焊料量,从而无需进行选择性波峰焊。所有与 ALPHA CVP-520 一起使用的组件都必须不含铅,从而不会形成熔点低于 100ºC。

特点和优势

  • Enables elimination of a second or third reflow cycle when temperature sensitive components or connectors are used.
  • Reduces energy consumption in reflow ovens versus standard lead free alloys.
  • Reduces reflow process cycle time.
  • Delivers 8 Hour stencil life.
  • Potential eliminations of bar solder, wave soldering flux and energy costs associated with wave soldering.
  • Compatible with all commonly used lead free surface finishes (Entek HT; Alpha Star Immersion Silver, Immersion Tin, Ni/Au, SACX HASL, etc.)
  • Excellent resistance to random solder balling minimizing rework and increasing first time yield.
  • Low temperature reflow profiles may enable the use of less expensive printed circuit board substrates, when appropriate.
  • Meets highest IPC 7095 voiding performance (Class III).
  • Provides excellent electrical reliability properties.
  • Zero halogen (no halogen intentionally added) and halide-free material.
  • Compatible with either nitrogen or air reflow.

请注意,英文版提供了最完整和最新的信息。更新本地语言信息时会有延迟。


 
  
*
(Press ctrl to select multiple)
*