ALPHA® CVP-390 是一种无铅、零卤素的免清洗锡膏,设计用于需要具有出色引脚测试属性以及通过 JIS 铜腐蚀测试能力的残留物的应用。此产品还被设计为具有一致的微间距印刷能力,最小为使用 100µm 厚的模板印刷的 180µm 的圆。其 出色的印刷量沉积重复性还可以通过减少与印刷工艺可变性相关的缺陷提供价值。此外,ALPHA® CVP-390 还具有 IPC7095 III 类空洞性能。


  • Long Stencil Life: consistent performance for at least 8 hours of continuous printing without addition of new paste
  • Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment 
  • Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C 
  • Reduced Random Solder Ball Levels: minimizes rework and increases first time yield 
  • Excellent Coalescence and Wetting Performance: coalesced 180µm circle deposit, even at high soak profile environment
  • Excellent Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high thermal soaking, without charring or burning 
  • Excellent Voiding Performance: Meets IPC7095 Class III Requirement 
  • Halogen Content: Zero Halogen, no halogen intentionally added 
  • Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test
  • Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements (see table below), as well as TOSCA & EINECS

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