IT / 电信

运用丰富经验与创新工程,Alpha 制定的焊接材料具有特殊性能,如熔化行为和温度,降低IT / 电信装配难度。最终产品长期具有可靠性和高性能。 Alpha 在 IT /电信应用领域的创新包括:焊膏、模板、助焊剂、线材、贴片胶和清洁剂。

Alpha IT 和电信市场产品

焊膏

Product Lead-Free SnPb Low Temp High Reliability Low Ag Water Soluble
OM-363 X



 
OM-338 L2 X




 
OM-353 X


X  
OM-340 X


X
 
CVP-390 X
    X
X
 
OM-338PT X          
OM-5100    X        
WS-820
X
    X
  X
WS-852 X
  X
X
  X

 

助焊剂



预成型焊料

Rectangle

square solder preform

S (Side)
Min = .020" (0.51mm)
Max = 2.30" (58.0mm)
T (Thickness)
Min = .002" (0.05mm)
Max = .200" (5.00mm


液态焊剂

Product Lead-Free SnPb High Reliability Low Ag Water Soluble
EF-2210
X X
  X  
EF-5601 X X   X  
EF-6000 X X   X  
EF-6100 X X X X  
EF-6100R X
X    
EF-6103 X X X X  
EF-6850HF X   X X  
EF-8000 X X X X  
EF-8300 X X X X  
EF-8800HF X   X X  
EF-9301 X X X X  
EF-12000 X X   X  
NR-205   X X    
RF-800 X X X X  
SLS-65C   X      
615-25 Series   X      


焊锡丝

Fluxes Flux Type IPC J-STD-004 Flux Classification Halogen Free* Halide Free**
TELECORE HF-850 No-Clean ROL0 X
X
TELECORE XL-825 ROL1   <1000 ppm***
RELIACORE 15 RMA ROL1    
ENERGIZED PLUS RA ROM1    
PURE CORE Rosin-Free Water Soluble ORM1    
AQUALINE 6000 ORH0  

X


 
  
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