选择性焊接

选择性焊接设备越来越广泛地应用于 PCB 装配领域。这主要是由于通孔装置设计为板材以及设备投资降低。因为选择性焊接过程与波峰焊接差异很大,Alpha 已开发出各种高性能、低成本的合格焊接材料供选择性焊接工艺使用。

Selective solder guide image

Alpha 选择性焊接指南


Alpha 选择性焊接指南

Alpha 液态助焊剂

Product Lead-Free SnPb High Reliability Low Ag Water Soluble
EF-2210 
X
  X  
EF-5601 X X   X  
EF-6000 X X   X  
EF-6100 X X X X  
EF-6103 X X X X  
EF-6850HF X   X X  
EF-8000 X X X X  
EF-8800HF X   X X  
EF-9301 X X X X  

 

 

Alpha 焊接合金

请使用以下表格确定适合您的 Alpha 合金。只需将装配类型与合适合金对应。
 

 Assembly Type
 I II III IV
Simple, single sided, FR2 / CEM-1 laminates
Dual sided FR-4 w/ PTH's, 1.6mm thick, up to 4 inner copper layers, metallized pad finishes
Complex, up to 12 inner copper layers, OSP pad finishes, all processing in air
>2.4mm thick, >12 inner copper layers, large high heat capacity components
     
 SACX Plus 0807


 
 SAC alloys label for table
  1%+ flux solids, L0, pin testable
 
Flux Type
  SACX Plus 0307
    4%+ flux solids, L or M0, pin testable
SnCX Plus® 07
          4%+ flux solids, L or M0, moderately pin testable
            7%+ flux solids, L,M or H1, not pin testable
0ºC to 100ºC - standard profile cycles
0ºC to 100ºC - standard and shock profile cycles
- 25ºC to 125ºC - standard and shock profile cycles
- 45ºC to 125ºC - standard and shock profile cycles
   
Thermal Fatigue Resistance
 



 

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